STURDY is mainly engaged in the independent R&D and production of packaging materials in the semiconductor industry, and strives to break the monopoly and technological blockade of foreign companies in this field. At present, many products have been recognized by the market.
Sturdy New Materials Science and Technology (Shenzhen) Ltd. Co. was founded in September 2020. It is engaged mainly in the R&D and production of conductive silver adhesive, which is widely used in IC and LED packaging in the semiconductor industry as a kind of die-attach glue. So far, we have two silver adhesive products, which have passed multiple rounds of testing and verification by benchmark customers in the industry, basically reaching the quality standards and performance indicators of international first-line brands. This has laid a solid foundation for the next step of large-scale mass production and domestic substitution. Our conductive silver glue has the characteristics of high electrical conductivity, high adhesion, high temperature resistance, high thermal conductivity and strong reliability.
Dr He Kangqiang (Alumnus, Dept. of Materials Science and Engineering, CityU)
Dr Du Peng (Alumnus, Dept. of Materials Science and Engineering, CityU)
Mr Huang Zhonghan (Graduate, Guangdong University of Technology)
Mr Zhong Wuwen (Graduate, Anhui Jianzhu University)
Dr Liu Chen (Alumnus, Dept. of Materials Science and Engineering, CityU)
Mr Luo Huahui (Alumnus, College of Business, CityU)
(Info based on the company's application form)
- CityU HK Tech 300 Angel Fund (2021)
- CityU HK Tech 300 Seed Fund (2021)
- 深創(chuàng)賽龍崗區(qū)新材料賽道團(tuán)隊(duì)組 一等獎(jiǎng)（2021）
- 深創(chuàng)賽市決賽新材料賽道團(tuán)隊(duì)組 優(yōu)秀獎(jiǎng)（2021）
- 創(chuàng)匯香湘創(chuàng)業(yè)比賽 二等獎(jiǎng)（2021）
- 深圳市龍崗區(qū)＂東進(jìn)杯＂大學(xué)生創(chuàng)新創(chuàng)業(yè)比賽 三等獎(jiǎng)（2020）